JPH0621250Y2 - 集積回路素子の冷却構造 - Google Patents

集積回路素子の冷却構造

Info

Publication number
JPH0621250Y2
JPH0621250Y2 JP1988059136U JP5913688U JPH0621250Y2 JP H0621250 Y2 JPH0621250 Y2 JP H0621250Y2 JP 1988059136 U JP1988059136 U JP 1988059136U JP 5913688 U JP5913688 U JP 5913688U JP H0621250 Y2 JPH0621250 Y2 JP H0621250Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
cooling structure
cooling
heat
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988059136U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01163339U (en]
Inventor
順子 金子
俊一 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1988059136U priority Critical patent/JPH0621250Y2/ja
Publication of JPH01163339U publication Critical patent/JPH01163339U/ja
Application granted granted Critical
Publication of JPH0621250Y2 publication Critical patent/JPH0621250Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988059136U 1988-04-30 1988-04-30 集積回路素子の冷却構造 Expired - Lifetime JPH0621250Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988059136U JPH0621250Y2 (ja) 1988-04-30 1988-04-30 集積回路素子の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988059136U JPH0621250Y2 (ja) 1988-04-30 1988-04-30 集積回路素子の冷却構造

Publications (2)

Publication Number Publication Date
JPH01163339U JPH01163339U (en]) 1989-11-14
JPH0621250Y2 true JPH0621250Y2 (ja) 1994-06-01

Family

ID=31284922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988059136U Expired - Lifetime JPH0621250Y2 (ja) 1988-04-30 1988-04-30 集積回路素子の冷却構造

Country Status (1)

Country Link
JP (1) JPH0621250Y2 (en])

Also Published As

Publication number Publication date
JPH01163339U (en]) 1989-11-14

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